, BC847 and BC848 are Preferred Devices General Purpose Transistors NPN Silicon Features Moisture Sensitivity Level: ESD Rating Human Body Model: >4000 ESD Rating Machine Model: >400 PbFree Packages are Available MAXIMUM RATINGS Rating Symbol alue Unit Collector-Emitter oltage BC847, BC8 CollectorBase oltage BC847, BC8 EmitterBase oltage BC847, BC8 CEO 65 45 CBO 80 EBO dc dc dc Collector Current Continuous I C 00 madc Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR5 Board, (Note ) T A = 5 C Derate above 5 C Thermal Resistance, JunctiontoAmbient (Note ) Total Device Dissipation Alumina Substrate (Note ) T A = 5 C Derate above 5 C Thermal Resistance, JunctiontoAmbient (Note ) P D 5.8 mw mw/ C R JA 556 C/W P D 0.4 mw mw/ C R JA 47 C/W BASE COLLECTOR EMITTER SOT CASE 8 STYLE 6 MARKING DIAGRAM xxm xx = Specific Device Code M = Date Code = PbFree Package (Note: Microdot may be in either location) See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Preferred devices are recommended choices for future use and best overall value. Junction and Storage Temperature Range T J, T stg. FR5 =.0 0.75 0.06 in.. Alumina = 0.4 0. 0.04 in 99.5% alumina. 55 to + C
ELECTRICAL CHARACTERISTICS (T A = 5 C unless otherwise noted) OFF CHARACTERISTICS Characteristic Symbol Min Typ Max Unit CollectorEmitter Breakdown oltage A,B (I C = 0 ma) BC847A,B,C, BC8B,C CollectorEmitter Breakdown oltage A,B (I C = 0 A, EB = 0) BC847A,B,C BC8B,C CollectorBase Breakdown oltage A,B (I C = 0 A) BC847A,B,C, BC8B,C EmitterBase Breakdown oltage A,B (I E =.0 A) BC847A,B,C, BC8B,C Collector Cutoff Current ( CB = ) ( CB =, T A = C) (BR)CEO 65 45 (BR)CES 80 (BR)CBO 80 (BR)EBO I CBO 5 na A ON CHARACTERISTICS DC Current Gain A, BC847A, BC848A (I C = 0 A, CE = ) B, BC847B, BC848B BC847C, BC848C h FE 90 70 (I C =.0 ma, CE = ) A, BC847A, BC848A B, BC847B, BC848B, BC849B, BC8B BC847C, BC848C, BC849C, BC8C 0 00 40 80 90 50 0 4 800 CollectorEmitter Saturation oltage (I C = 0 ma, I B = 0.5 ma) CollectorEmitter Saturation oltage (I C = 00 ma, I B = ma) CE(sat) 0.5 0.6 BaseEmitter Saturation oltage (I C = 0 ma, I B = 0.5 ma) BaseEmitter Saturation oltage (I C = 00 ma, I B = ma) BE(sat) 0.7 0.9 BaseEmitter oltage (I C =.0 ma, CE = ) BaseEmitter oltage (I C = 0 ma, CE = ) BE(on) 580 660 700 770 m SMALLSIGNAL CHARACTERISTICS CurrentGain Bandwidth Product (I C = 0 ma, CE = dc, f = 00 MHz) f T 00 MHz Output Capacitance ( CB = 0, f =.0 MHz) C obo 4.5 pf Noise Figure (I C = 0. ma, CE = dc, R S =.0 k, f =.0 khz, BW = 00 Hz) A,B, BC847A,B,C, BC848A,B,C BC849B,C, BC8B,C NF 0 4.0 db Figure.
ALT ALTG ALT ALTG Device Marking Package Shipping A SOT SOT (PbFree) SOT SOT (PbFree) BLT SOT BLTG BLT B SOT (PbFree) SOT BLTG SOT (PbFree) BC847ALT SOT BC847ALTG BC847ALT E SOT (PbFree) SOT BC847ALTG SOT (PbFree) BC847BLT SOT BC847BLTG BC847BLT F SOT (PbFree) SOT BC847BLTG SOT (PbFree) BC847CLT SOT BC847CLTG BC847CLT G SOT (PbFree) SOT BC847CLTG SOT (PbFree) BC848ALT SOT BC848ALTG J SOT (PbFree) BC848BLT BC848BLTG BC848BLT BC848BLTG K SOT SOT (PbFree) SOT SOT (PbFree) BC848CLT SOT BC848CLTG BC848CLT L SOT (PbFree) SOT BC848CLTG SOT (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. 5
BC849BLT BC849BLTG BC849BLT BC849BLTG Device Marking Package Shipping B SOT SOT (PbFree) SOT SOT (PbFree) BC849CLT SOT BC849CLTG BC849CLT C SOT (PbFree) SOT BC849CLTG SOT (PbFree) BC8BLT SOT BC8BLTG F SOT (PbFree) BC8CLT SOT BC8CLTG G SOT (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. 6
PACKAGE DIMENSIONS SOT (TO6) CASE 808 ISSUE AL D E H E NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: INCH.. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 80 THRU 07 AND 09 OBSOLETE, NEW STANDARD 808. b e A A L C MILLIMETERS DIM MIN NOM MAX MIN A 0.89.00. 0.0 A 0.0 0.06 0.00 0.0005 b 0.07 0.44 0. 0.0 c 0.085 0. 0.77 0.004 D.80.90.04 0.0 E.0..40 0.047 e.78.90.04 0.070 L 0.5 0.54 0.69 0.040 H E.0.40.64 0.08 INCHES NOM MAX 0.095 0.0440 0.00 0.0040 0.075 0.000 0.005 0.0070 0.40 0.97 0.05 0.055 0.07 0.0807 0.0 0.085 0.0940 0.09 STYLE 6: PIN. BASE. EMITTER. COLLECTOR SOLDERING FOOTPRINT* 0.95 0.07 0.95 0.07.0 0.079 0.9 0.05 0.8 0.0 SCALE 0: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 7